High Resolution Beam Imaging Systems-BIS


High-resolution beam imaging is made possible with the Colutron Beam Imaging Systems (BIS). The BIS can be used to measure two or three dimensional intensity distributions of ion, electron and neutral beams. The BIS can also be used to image X-rays for applications such as pinhole imaging and spectroscopy. Images are created using a microchannel plate (MCP) and phosphor screen. The phosphor is uniformly deposited onto a coherent fiberoptic (FO) substrate so that the image can be optically transmitted to the outside of a vacuum system for analysis using a FO conduit. The BIS systems are available in many different configurations with several options for image readout to best fit a customer's particular application and budget.

 

Model BIS-4135 (Remote System)

     

Model BIS-4105 (Standard System)               Model BIS-3125 (Standard System)

                                                                    with optional model 725 fiber optic cable 

Features:

  Available with single or dual MCPs 
  Microsphere plates (MSP) also available 
  Spatial resolution down to 25m m 
  Interchangeable probe heads for changing imaging area, gain and/or resolution 
  Digital readout CID or CCD cameras 
  CID/CCD cameras available with fiberoptic faceplate for direct fiberoptic coupling to probe head 
  Available with flexible fiberoptic cable for remote imaging applications 
  Phosphor screen available aluminized (standard) or Indium-Tin Oxide (ITO) 
  Front mounting grids available for electron suppression, beam attenuation, beam acceleration 
  UHV compatible
  Microchannel plate performance enhancement options available

 
 

Applications:

  High Resolution Single Particle Position Sensitive Detection 
  Remote Beam Line Diagnostics 
  Real Time Image Analysis 
  Remote Beam Profile Analysis (beam tuning) 
  Mass Spectrometry (mass and dispersion determination) 
  Low Energy and Low Intensity Beam Imaging 
  X-ray Spectroscopy 
  Field Ion Microscopy 

 

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4 keV OH+ ion beam (0.86mm FWHM) made with Model G-1 Ion Gun System, Model BIS-1035 Beam Imaging System, and IPS-1 Image Processing System.

 Beam Imaging System (BIS)-General Description

BEAM IMAGING SYSTEM - (BIS)

General Description

The BIS systems consist of three basic components: 1) the BIS probe head which houses the MCP and phosphor screen; 2) a fiberoptic conduit which optically transmits the image from the probe head to a fiberoptic vacuum feedthrough; and, 3) a camera system for digital readout of the image. These components are described in detail below.

PROBE HEAD

The BIS probe head creates an image of a beam by converting the incoming beam to electrons by secondary electron emission from the probe head microchannel plate (MCP). The electrons are then accelerated onto a phosphor screen with enough energy to excite the phosphor and create an image. The phosphor is deposited uniformly across a coherent fiberoptic (FO) disc or taper. The BIS-1 systems use a 1:1 magnification FO disc whereas, in order to image larger areas, the BIS-2, BIS-3 and BIS-4 systems use FO tapers with corresponding magnifications of 2x, 3x, and 4x. Optional microsphere (MSP) plates are also available in a single or dual stack. These plates have higher gain per stage, no ion feedback, and less severe vacuum requirements than MCPs, but have poorer spatial resolution (see MSP - MCP Comparison Chart and Imaging System Specifications. All BIS probe heads are interchangeable, allowing the user to change image resolution and image area by simply switching the probe head

 

Probe Head Specifications

Probe Head Model Number

Image Area

Approximate Spatial Resolution

BIS-1-PH

17mm diam.

25-35 m m

BIS-2-PH

25.4mm diam.

50-70 m m

BIS-3-PH

38.4mm diam.

75-100 m m

BIS-4-PH

~ 44.45mm diam.

150 m m

 PROBE HEAD - OPTIONAL CONFIGURATIONS

 Probe heads are available with a single MCP (standard) or dual MCP (chevron) configuration for increased gain. Also available are microsphere plates (MSP) in single or dual stack. These plates have higher gain per stage and less severe vacuum requirements, but have poorer spatial resolution (see Beam Imaging Specifications on page 27).

  The Phosphor Screens come standard with P-20 phosphor and conductive aluminum coating. Other phosphors are available upon special request, as well as an Indium-Tin-Oxide (ITO) coating. ITO screens are generally used when lower electron accelerating voltages are required, however the quantum yield may be lower than that of aluminized screens.

 The probe heads also allow for mounting a variety of apertures, slits, lenses, pinholes, filters and grids. All probe heads have holes for mounting 1/8" (3mm) diameter ceramic mounting rods. Colutron offers a small selection of grids that can be mounted in front of the probe head for applications such as electron suppression, beam attenuation, and beam acceleration. A 4-terminal high voltage feedthrough on 2 3/4" (DN35) conflat flange is provided with the BIS system for the phosphor screen and MCP voltage application.

 The input microchannel plate is also available with performance enhancement coatings to enhance the detection efficiency for certain types of radiation. The table below outlines the available coatings.

Coating Type

Radiation Type Enhanced

Energy Range

Coating Thickness (Å)

Coating Extension (Channel Diameters)

CuI

UV

200-2000 Å

3000

1.5

CsI

UV

200-2000 Å

3000

1.5

MgFl2

UV

350-1200 Å

3000

1.5

KBr

X-Ray

0.2-9 keV

3000

1.5

 

FIBEROPTIC CONDUITS

Images are transmitted optically from the probe head through one of two types of FO conduits which both include a 2 3/4" (DN35) conflatÒ FO vacuum viewport enabling imaging on the outside of the vacuum chamber (see CCD and CID camera options below). Conduits consist of either a flexible 60cm long, 10mm x 8mm rectangular FO cable (Remote System) or 19mm diameter solid FO rod (Standard System) which is available in various lengths. Both conduit types attach at one end to the BIS probe head, and to the FO viewport at the other end. The remote systems with flexible FO cable are especially useful for imaging particle beams deep within the vacuum chamber where the beam cannot be brought to a vacuum port for imaging. The 60cm length is standard, however other lengths are available on request. The standard systems with solid FO rod are generally used when the beam can be brought close to a vacuum port for imaging. The FO rod is available in various lengths to allow for greater flexibility when adapting to a customer's particular application.

CCD AND CID CAMERA OPTIONS

Optional CCD and CID camera readout systems are available for all BIS systems. All cameras are available with lens, video monitor and mounting system for imaging the FO viewport. The CIDTEC 3710D and COHU 4812 cameras are also available with fiberoptic faceplates (FOFP) directly attached to the camera sensor. The camera sensor is then mounted in a special housing which allows them to directly mate to the FO viewport. This direct FO coupling approach ensures highest possible resolution and gain.

The camera can be connected to a video monitor in order to observe images in real time, and can also be connected to a video frame grabber making it possible to store and analyze the images later. Colutron offers the optional Image Processing Systems-IPS which include video monitor, frame grabber, cables and software.

CCD/CID Camera Specifications

Camera

CIDTEC 3710D

COHU 4812

COHU 2122

Optical Format

2/3" diagonal

2/3" diagonal

1/2" diagonal

Resolution

755H x 484V

755H x 488V

768H x 494V

Element Pitch (m m)

12.0 x 13.7

11.5 x 27

8.4 x 9.8

Area (mm)

9.05 x 6.83

8.8 x 6.6

6.4 x 4.8

FOFP (Optional)

4.5 m m pitch

4.5 m m pitch

N/A

Scanning Format

RS-170, 2:1 Interlace

EIA RS-170

EIA RS-170

Electronic Shutter

 

 

1/60 - 1/10,000 sec.

Sync. System

Int./Ext.

Int./Ext.

Int./Ext.

Signal to Noise (db)

50

50

>55

Sensitivity (Face Plate Illumination

Full Output: 0.5fc

Full Output: 0.2 lux

Full Output: 0.65 lux

Input Power (Watts)

8.5 max.

4.2

3.6

Input Voltage (Volts)

+ 15VDC nominal

+12VDC

+12VDC

 

BIS Ordering Information

Use the table below to determine the BIS model that fits your application. For example, a Model BIS-3135 decodes as a BIS system with BIS-3-PH probe head, dual MCPs, 60cm long fiberoptic cable with 2 3/4" (DN35) conflatÒ viewport, and fiberoptically coupled CIDTEC 3710D camera. NOTE: All BIS systems include a four terminal, 2 3/4" conflat (DN35) high voltage feedthrough (Colutron part number PN-706).

BIS - X

Probe Head

X

MCP Options

X

FO Conduit

X

Camera System

1-BIS-1-PH

0-Single MCP

0-FO Rod(2" long)/FO Viewport

0-None

2-BIS-2-PH

1-Dual MCP

1-FO Rod(3" long)/FO Viewport

1-COHU 2122/Lens/Mount

3-BIS-3-PH

2-Single MSP

2-FO Rod(4" long)/FO Viewport

2-COHU 4812/Lens/Mount

4-BIS-4-PH

3-Dual MSP

3-FO Cable(60cm)/FO Viewport

3-CIDTEC 3710D/Lens/Mount

4-None (Phosphor only)

4-COHU 4812/FOFP/Mount

5-Special Coating (specify type)

5-CIDTEC3710D/FOFP/Mount

 

REMOTE SYSTEM DIMENSIONS

The dimensions for the BIS system with optional FO cable and CIDTEC camera with FOFP are shown below.

REMOTE BEAM IMAGING SYSTEM DIAGRAM

DIMENSIONS (Remote Beam Imaging Systems)

 

Models*

BIS-1X35

BIS-2X35

BIS-3X35

BIS-4X35

DIM (mm)

 

 

 

 

 

A

 

83.5

83.5

83.5

83.5

B

 

68.3

68.3

68.3

68.3

C

 

108.0

108.0

108.0

108.0

D

 

63.5

76.2

88.9

101.5

E

 

24.8

43.3

56.3

70.09

F

 

12.7

12.7

12.7

12.7

G

 

566.7

566.7

566.7

566.7

H

 

4.7

4.7

4.7

4.7

Cable end-tip
O.D. (f )

 

34.3

34.3

34.3

34.3

* NOTE: The model number X descriptor determines the MCP option see BIS Ordering Information

 

STANDARD BEAM IMAGING SYSTEM DIAGRAM

DIMENSIONS (Standard Beam Imaging Systems)

 

Models*

BIS-1X05

BIS-1X15

BIS-1X25

BIS-2X05

BIS-2X15

BIS-2X25

DIM (mm)

A

 

83.5

83.5

83.5

83.5

83.5

83.5

B

 

68.3

68.3

68.3

68.3

68.3

68.3

C

 

108.0

108.0

108.0

108.0

108.0

108.0

D

 

63.5

63.5

63.5

76.2

76.2

76.2

E

 

24.8

24.8

24.8

43.3

43.3

43.3

F

 

12.7

12.7

12.7

12.7

12.7

12.7

G

 

23.6

49.0

74.4

23.6

49.0

74.4

Fiberoptic
Rod O.D. 

 

19.1

19.1

19.1

19.1

19.1

19.1

  *NOTE: The model number X descriptor determines the MCP option see BIS Ordering Information

 

Models*

BIS-3X05

BIS-3X15

BIS-3X25

BIS-4X05

BIS-4X15

BIS-4X25

DIM (mm)

A

 

83.5

83.5

83.5

83.5

83.5

83.5

B

 

68.3

68.3

68.3

68.3

68.3

68.3

C

 

108.0

108.0

108.0

108.0

108.0

108.0

D

 

88.9

88.9

88.9

101.5

101.5

101.5

E

 

56.3

56.3

56.3

70.09

70.09

70.09

F

 

12.7

12.7

12.7

12.7

12.7

12.7

G

 

23.6

49.0

74.4

23.6

49.0

74.4

Fiberoptic
Rod O.D. 

 

19.1

19.1

19.1

19.1

19.1

19.1

*NOTE: The model number X descriptor determines the MCP option see BIS Ordering Information

BIS SPECIFICATIONS

Imaging Area:

  9.1mm x 6.6 mm Colutron Model BIS-1000 series, 18.2mm x 13.2 mm Colutron Model BIS-2000 series,

27.3mm x 19.8mm Colutron Model BIS-3000 series, approx. 36.4mm x 26.4mm Colutron Model BIS-4000 series

Camera: CID

  776H x 512V Total Pixels, 755H x 484V Displayed Pixels, 12.0 micron x 13.7 micron pixel size
  + 15VDC nominal (+11.0 to + 17.0) Input Voltage
  RS-170, 2:1 Interlace Scanning Format
  Full output at 0.3fc Faceplate Illumination (T=2850 K)
  Spectral Response: 0.11 Amps/Watt at l = 560 nm (P-20)
  Quantum Efficiency: ~23 % at l = 560 nm (P-20)
  Fiberoptic Faceplate 4.5 micron pitch, 4mm thick

Fiberoptic Cable:

  10.0 mm x 8.0 mm image area, 10 micron square fiber size
  (Remote Systems) 600 mm length, flexible, UHV Compatible

Fiberoptic Rod:

  Available in 2", 3" or 4" lengths, 3/4" diameter
(Standard Systems) 6 micron diameter fiber size

MCP: (Standard)

  0.975" Diameter, single plate (BIS-1000 series), chevron (BIS-1100 series)
  1.289" Diameter, single plate (BIS-2000 series), chevron (BIS-2100 series)
  1.970" Diameter, single plate (BIS-3000, BIS-4000 series), chevron (BIS-3100, BIS-4100 series)
  10 micron channel diameter
  Max. Gain: 2.0 x 10 4 (single plate), 1.0 x 10 7 (chevron)
  Spatial resolution: 41 lp/mm
MSP: (Optional)

  0.980" Diameter,
  single plate (BIS-1200 series), chevron (BIS-1300 series)
  1.291" Diameter,
  single plate plate (BIS-2200 series), chevron (BIS-2300 series)
  1.970" Diameter,
  single plate (BIS-3200, BIS-4200 series), chevron (BIS-3300,BIS-4300 series)
  50 micron sphere diameter
  Max. Gain: 1.5 x 106 (one plate, 3000V), 1.0 x 109 (dual plate,4000V)
  Spatial resolution: 2 lp/mm

Phosphor Screen:

  P-20 deposited onto Aluminized Fiberoptic Faceplate Fiberoptic Faceplate Fiber Size: 6 micron diameter
  Conversion Efficiency: h = 0.063 photons/eV/electron
  P-20 Peak Wavelength:l = 560 nm
  Optional ITO (Indium Tin Oxide) coating available
  Optional P-11, P-43, P-46, P-47 phosphor coatings available

Power Supply Requirements: (see optional PCU Power Control Units)

  0 - + 1000V, 1 mA single Microchannel Plate
  0 - + 2000V, 1 mA dual Microchannel Plate (chevron)
  0 - + 3000V, 1mA single Microsphere Plate
  0 - + 4000 V, 1mA dual Microsphere plate
  0 - + 5000V, 1 mA Phosphor Screen

Vacuum:

  1 x 10-6 Torr or better required to operate MCP, 1 x 10-5 or better to operate MSP
  Good to at least 1 x 10-10 Torr; Maximum bakeout temp. 150 C


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